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What's New! (2022) | |||
2023/03/24 | ◆ The following general specification has been released. | ||
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2023/03/15 | ◆ The following detail specifications and application data sheets have been released. | ||
Power MOSFET, N-Channel,Radiation Hardened |
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Power MOSFET, N-Channel,Radiation Hardened |
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Power MOSFET, N-Channel,Radiation Hardened |
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Power MOSFET, P-Channel,Radiation Hardened |
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Power MOSFET, N-Channel,Radiation Hardened |
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Power MOSFET, N-Channel,Radiation Hardened |
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2023/02/14 | ◆ The following application data sheets have been released. | ||
TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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TRANSFORMERS AND INDUCTORS, POWER |
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2023/01/16 | ◆ The following application data sheet has been released. | ||
Connectors, Rectangular, Miniature, High Density |
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2022/12/09 | ◆ The following detail specification and application data sheet have been released. | ||
CAPACITORS, CHIP, FIXED, FINE CERAMIC DIELECTRIC, (TEMPERATURE STABLE AND GENERAL PURPOSE)(N2040/L104) |
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2022/11/02 | ◆ The following application data sheets have been released. | ||
Connectors, Rectangular, Microminiature |
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Crystal Units, Quartz |
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2022/10/07 | ◆ The 35th Microelectronics Workshop(MEWS35) will be held by JAXA as follows; Date: October 27th and 28th, 2022. Venue: Tsukuba International Congress Center, Japan, and online. The MEWS35 pre-registration web-page: https://ssl.tksc.jaxa.jp/mews/en/index.html?resistration |
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2022/09/29 | ◆ The following detail specification and application data sheet have been released. | ||
Fine Pitch Printed Wiring Boards, Glass Base Woven Polyimide Resin or Glass Base Woven Epoxy Resin Base Material |
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2022/09/16 | ◆ The following general specification has been released. | ||
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◆ The following detail specification and application data sheet have been released. | |||
Printed Wiring Boards, CIC Controlled Thermal Expansion, Glass Base Woven Polyimide Resin Base Material |
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2022/08/05 | ◆ The following general specification has been released. | ||
COMMON PARTS/MATERIALS |
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2022/06/20 | ◆ The following application data sheets have been released. | ||
Printed Wiring Boards, Area Array Packaging |
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Printed Wiring Boards For High-speed Signals |
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2022/03/25 | ◆ The recommended web browser for viewing this database has been changed from "Internet Explorer (IE) 11" to "Microsoft Edge". Please use "Microsoft Edge" from this day forward, and clear the browser cache before use for viewing up-to-date information. Please contact us for more information. |
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